Steel surface

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Process Stage	Parameter Category	Specific Parameters/Description
Substrate Pretreatment	Cleaning Process	Alkaline degreaser/organic solvent for oil removal; dilute nitric acid passivation to remove oxide scale
Substrate Pretreatment	Surface Quality	Surface roughness $R_{a} \leq 0.2 μ m$ after polishing (mechanical polishing/chemical polishing)
Vacuum Preparation Stage	Vacuum Control	Rough pumping to $1 0^{- 1} Pa$ , fine pumping to $1 0^{- 4} \sim 1 0^{- 5} Pa$
Vacuum Preparation Stage	Substrate Preheating	Temperature $100 \sim 30 0^{\circ} C$ (to remove surface adsorbed moisture)
Magnetron Sputtering Film Deposition	Target Material Selection	Ti, Cr, Zr, Al (purity ≥ 99.9%)
Magnetron Sputtering Film Deposition	Process Gas	Ar (for sputtering ionization, flow rate 50~200 sccm); $N_{2} / C_{2} H_{2}$ (reaction gas, flow rate 50~150 sccm)
Magnetron Sputtering Film Deposition	Deposition Temperature	200∼350∘C
Magnetron Sputtering Film Deposition	Film Performance	Hardness $HV 1500 \sim 2500$ ; Adhesion (cross-cut test) Grade 5B; Neutral salt spray resistance ≥ 1000 hours
Arc Ion Plating Film Deposition	Target Material Selection	Ti, Cr, Zr (including alloys, e.g., TiAl)
Arc Ion Plating Film Deposition	Process Gas	Ar (for arc ionization, flow rate 100~300 sccm); $N_{2} / O_{2}$ (reaction gas, flow rate 50~100 sccm)
Arc Ion Plating Film Deposition	Deposition Temperature	300∼500∘C
Arc Ion Plating Film Deposition	Film Performance	Hardness $HV 2000 \sim 3500$ ; Adhesion (cross-cut test) Grade 5B; Neutral salt spray resistance ≥ 1500 hours
Post-treatment Stage	Cooling Requirement	Naturally cool in vacuum chamber to $\leq 8 0^{\circ} C$ (prevent film cracking due to temperature difference)
Post-treatment Stage	Surface and Inspection	Precision polishing to improve gloss; cross-cut test for adhesion, Vickers hardness tester for hardness, salt spray test for corrosion resistance